Semiconductor manufacturing processes require the highest levels of cleanliness and reliability. Sealing components must be able to withstand harsh chemicals, high temperatures, and ultrafine particles while maintaining their integrity and preventing contamination.
Key considerations include:
- Innovative Solutions: Employing innovative sealing solutions that are specifically designed to withstand the demanding conditions of semiconductor manufacturing processes.
- Cleanroom Manufacturing: Producing seals in controlled cleanroom environments to minimize contamination risk.
- Advanced Materials: Utilizing advanced materials, such as perfluoroelastomers, that offer excellent chemical resistance and thermal stability.